Relife RL-088 Universal Magnetic Base for Mobile Phone BGA Soldering

Relife RL-088 Tin-planted Universal Magnetic Base for Mobile Phone BGA Soldering Repair Features: RL-088 tin-planted universal magnetic fixture, say goodbye to paper towel planting tin, which can be used for chip positioning and adhesive removal, and strong magnetic adsorption for tin planting It has the characteristics of anti-static, strong magnetic adsorption, high-temperature resistance, steel plate weight gain, chemical corrosion resistance, etc Multifunctional double-sided double-use, it is suitable for repairing motherboards of different shapes, general tin planting of various BGA chips, etc Front side – suitable for all kinds of BGA chips; Reverse side – suitable for different shapes of motherboards Various types of tin-planting stencils are commonly used, which can effectively avoid the phenomenon of tinning on the bottom of the stencil due to heating and swelling Multifunctional position adjustment, decompression protection, tin planting automatically balances the stencil and decompress it, effectively protecting the chip and making it safer New silicone material, high-temperature resistance without bulging, flame retardant, corrosion resistance Insulating material, with good anti-collision / anti-skid / anti-acid properties, and wear-resistant and easy to clean Embedded high-temperature magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism unchanged High hardness weight-added steel, strong anti-deformation ability, high-quality carbon steel material, not afraid of corrosion