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Mechanic iBGA 13 Max 14-IN-1 Motherboard Middle Layer Reballing Platform FOR iPhone X To 13 Pro Max

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Mechanic iBGA 13 Max 14-IN-1 Motherboard Middle Layer Reballing Platform FOR iPhone X To 13 Pro Max

Original price was: ₨3,000.00.Current price is: ₨2,498.00.

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SKU: IBGA13MAX

Description

MECHANIC IBGA13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X – 13 Pro Max Mini,Mechanic Middle Layer Tin Planting Platform iBGA13 MAX for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max Tin planting steel mesh positioning plate. MECHANIC iBGA13 MAX Middle Layer Positioning Tin Planting Platform Stencil Suit Support for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max Motherboard. Features: Double-sided positioning – single module realizes the middle-layer tin planting of X-13 system. Strong magnetic adsorption – no displacement during the tin planting process. Special grade steel mesh-mesh precision tin planting Wulian tin. High temperature base – high temperature operation does not change shape, quality assurance! Package Contains: 2x Reballing Platform 7x Stencils  

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