AMAOE Stencil Qualcomm CPU QU4 0.12mm

The pad strengthens the fixed pin, which will never fall off Adopt industrial grate printed circuit board copper foil with a thickness of 30m Good flatness , effectively preventing false welding caused by unevenness BGA bonding surface has high saturation,stable electrical performance, and good welding strength, and it is not easy to drop and unsolder The connection point with the circuit is firm, and the green oil fixing strength is good It saves time and effort, saves the trouble of flying wires and loops,and has high maintenance efficiency