Description
[vc_row css=”.vc_custom_1611847391626{margin-bottom: 20px !important;}”][vc_column][vc_column_text] RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin Item Specification : Meet the maintenance needs of motherboards for Samsung, Oppo, Vivo,Redmi and Apple etc. high-end machines A low temperature lead-free solder paste customized for high-end motherboard repair RL-404 138 ° C low temperature solder paste [/vc_column_text][/vc_column][/vc_row]
There are no reviews yet.