Luowei HS3 Uniform Preheat Platform for Motherboard Chip BGA Repair

Luowei HS3 Uniform Preheat Platform for Motherboard Chip BGA Repair Features: Uniform heating, no hot air gun required, no soldering iron required Aerospace aluminum alloy plate, efficient heating coverage, reduces energy consumption, broad application range Compact and portable, compact size, powerful performance precise temperature control Maximum power 99W, PD power delivery, more rapid heating Light interactivity, simple operation, and color changes reflect the device’s status preheat platform, tinning, degumming, laminating, temperature control, vibrant light interaction, safe and constant temperature Infinite control knob, simple operation, one-touch adjustment The heating area eliminates excess and enhances efficiency and precise heating, 65mm×100mm fits various sizes of smartphone motherboards Package includes: 1 x Platform